Enabling the digital world

ASMPT NEXX is a leading supplier of Advanced Packaging deposition equipment for the semiconductor industry, providing sputtering (PVD) and electroplating (ECD) tools to customers worldwide. Our highly flexible systems include:

Wafer Level Sputtering Equipment
Wafer Level Plating Equipment
Panel Level Plating Equipment

Our tools are used for Wafer Level Packaging, 2.5/3D Integrated Circuits, Fan out, Embedded die and other heterogeneous integration processes.  For more information, please contact our team of experienced engineers and technologists worldwide here.

SEMICON EUROPA 2022
SEMICON EUROPA
November 15-18, 2022 MESSE MUNCHEN Co-located with electronica TELTEC Booth C1115
NEPCON VIETNAM 2022
I.C.E. Hanoi (Cung Van Hoa) 91 Tran Hung Dao Street, Hanoi, Vietnam
September 14-16 2022
We are ASMPT: Global Brand Video
ASMPT: Global Brand Video
ASMPT: We are ASMPT NEXX, Inc.
SEMICON West 2022
HYBRID SEMICON West 2022 offers both a [LIVE] and VIRTUAL environment
July 12 - 14 2022
SEMICON Korea 2023
Seoul, South Korea
February 9, 2023 | 10:00 am - February 11, 2023 | 12:00 pm
300th System Shipment Celebration
ASM NEXX 300th System Shipment Celebration (click Events for additional information)
ASM NEXX, Inc. Billerica Office
IWLPC 2022
DoubleTree by Hilton - San Jose, San Jose, California
February 15-17, 2022
IMAPS 2022
Hynes Convention Center, Boston MA
October 3-6, 2022
Pan Pacific Microelectronics Symposium 2023
Pan Pacific Microelectronics Symposium 2023 Kauai, Hawaii
January 30 - February 2, 2023