Enabling the digital world

ASMPT NEXX is a leading supplier of Advanced Packaging deposition equipment for the semiconductor industry, providing sputtering (PVD) and electroplating (ECD) tools to customers worldwide. Our highly flexible systems include:

Wafer Level Sputtering Equipment
Wafer Level Plating Equipment
Panel Level Plating Equipment

Our tools are used for Wafer Level Packaging, 2.5/3D Integrated Circuits, Fan out, Embedded die and other heterogeneous integration processes.  For more information, please contact our team of experienced engineers and technologists worldwide here.

We are ASMPT: Global Brand Video
ASMPT: Global Brand Video
ASMPT: We are ASMPT NEXX, Inc.
SEMICON West 2022
HYBRID SEMICON West 2022 offers both a [LIVE] and VIRTUAL environment
July 12 - 14 2022
SEMICON Korea 2023
Seoul, South Korea
February 9, 2023 | 10:00 am - February 11, 2023 | 12:00 pm
300th System Shipment Celebration
ASM NEXX 300th System Shipment Celebration (click Events for additional information)
ASM NEXX, Inc. Billerica Office
SEMICON EUROPA 2022
SEMICON EUROPA
November 15-18, 2022 MESSE MUNCHEN Co-located with electronica
IWLPC 2022
DoubleTree by Hilton - San Jose, San Jose, California
February 15-17, 2022
IMAPS 2022
Hynes Convention Center, Boston MA
October 3-6, 2022
Pan Pacific Microelectronics Symposium 2023
Pan Pacific Microelectronics Symposium 2023 Kauai, Hawaii
January 30 - February 2, 2023