ASMPT NEXX Enabling the digital world

ASMPT NEXX is a leading supplier of Advanced Packaging deposition equipment for the semiconductor industry, providing sputtering (PVD) and electroplating (ECD) tools to customers worldwide. Our highly flexible systems include:

Wafer Level Sputtering Equipment
Wafer Level Plating Equipment
Panel Level Plating Equipment

Our tools are used for Wafer Level Packaging, 2.5/3D Integrated Circuits, Fan out, Embedded die and other heterogeneous integration processes.  For more information, please contact our team of experienced engineers and technologists worldwide here.