ASMPT NEXX is a leading supplier of Advanced Packaging deposition equipment for the semiconductor industry, providing sputtering (PVD) and electroplating (ECD) tools to customers worldwide. Our highly flexible systems include:
• Wafer Level Sputtering Equipment
• Wafer Level Plating Equipment
• Panel Level Plating Equipment
Our tools are used for Wafer Level Packaging, 2.5/3D Integrated Circuits, Fan out, Embedded die and other heterogeneous integration processes. For more information, please contact our team of experienced engineers and technologists worldwide here.
