RDL Copper Plating Process for Panel Level Packaging Application
NEXX co-authored a paper (attached) that was presented (by the co-authoring chemical company, MacDermid Alpha) RDL Copper Plating Process for…
ISES USA 2023
“Valuation of Artificial Intelligence for Semiconductor Equipment” was presented by Jon Hander – AVP Panel Products at ASMPT NEXX
We are ASMPT: Global Brand Video
We are ASMPT: Global Brand Video – YouTube ASMPT the leading global provider of hardware and software solutions for the…
300th System Shipment Celebration
On November 21 2019 ASM NEXX celebrated its 300th system shipment.