RDL Copper Plating Process for Panel Level Packaging Application
NEXX co-authored a paper (attached) that was presented (by the co-authoring chemical company, MacDermid Alpha) RDL Copper Plating Process for…
NEXX co-authored a paper (attached) that was presented (by the co-authoring chemical company, MacDermid Alpha) RDL Copper Plating Process for…
“Valuation of Artificial Intelligence for Semiconductor Equipment” was presented by Jon Hander – AVP Panel Products at ASMPT NEXX
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On November 21 2019 ASM NEXX celebrated its 300th system shipment.