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ASM NEXX is a worldwide leading supplier of metallization Advanced Packaging Deposition Equipment specializing in sputtering (PVD) and plating (ECD) processes. Our highly flexible systems offering supports:
• Wafer Level Sputtering Equipment
• Wafer Level Plating Equipment
• Panel Level Plating Equipment
Our market focus includes: WLP, 2.5D/3D IC, TSV, Fan out, Embedded Die among many others. For more information, please contact our professional team of experienced engineers worldwide here.
