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ASM NEXX is a worldwide leading supplier of metallization Advanced Packaging Deposition Equipment specializing in sputtering (PVD) and plating (ECD) processes. Our highly flexible systems offering supports:

Wafer Level Sputtering Equipment
Wafer Level Plating Equipment
Panel Level Plating Equipment

Our market focus includes: WLP, 2.5D/3D IC, TSV, Fan out, Embedded Die among many others. For more information, please contact our professional team of experienced engineers worldwide here.

Apollo 300

Stratus 300

Stratus P500

Events

NEPCON JAPAN 2023
Tokyo Big Sight, Japan
January 25-27 2023 Booth Number: 7-1
Pan Pacific Microelectronics Symposium 2023
Pan Pacific Microelectronics Symposium 2023 Kauai, Hawaii
January 30 - February 2, 2023
SEMICON Korea 2023
Seoul, South Korea
February 9, 2023 | 10:00 am - February 11, 2023 | 12:00 pm
IWLPC 2023
Marriott Fremont Silicon Valley - Fremont, California
February 14-16, 2023
IMAPS 2023
Fountain Hills, AZ
March 13-16 2023
SEMICON West 2023
Moscone Center, San Francisco, CA
July 11 - 13 2023
NEPCON VIETNAM 2023
International Center of Exhibition (I.C.E.) Hanoi
September 6-8 2023
SEMICON EUROPA 20223
SEMICON EUROPA
November 14-17, 2023 MESSE MUNCHEN Co-located with electronica TELTEC Booth C1115