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ASM NEXX is a worldwide leading supplier of metallization Advanced Packaging Deposition Equipment specializing in sputtering (PVD) and plating (ECD) processes. Our highly flexible systems offering supports:

Wafer Level Sputtering Equipment
Wafer Level Plating Equipment
Panel Level Plating Equipment

Our market focus includes: WLP, 2.5D/3D IC, TSV, Fan out, Embedded Die among many others. For more information, please contact our professional team of experienced engineers worldwide here.

Apollo 300

Stratus 300

Stratus P500

Events

NEPCON JAPAN 2023
Tokyo Big Sight, Japan
January 25-27 2023 Booth Number: 7-1
Pan Pacific Microelectronics Symposium 2023
Pan Pacific Microelectronics Symposium 2023 Kauai, Hawaii
January 30 - February 2, 2023
SEMICON Korea 2023
Seoul, South Korea
February 9, 2023 | 10:00 am - February 11, 2023 | 12:00 pm
IWLPC 2023
Marriott Fremont Silicon Valley - Fremont, California
February 14-16, 2023
IMAPS 2023
Fountain Hills, AZ
March 13-16 2023
Touch Taiwan 2023
Nangang Exhibition Center, Hall 1, 4F, Taipei, Taiwan
April 19-21 BOOTH M307
ECTC 2023
JW Marriot, Orlando FL
May 30 to June 2 2023 Booth #237
EAC China 2023
Suzhou International Expo Center, China
June 5 – 7 2023
SEMICON China 2023
Shanghai New International Expo Centre, China
June 29 – July 1 2023, Hall E3, Booth E3451
SEMICON West 2023
Moscone Center, San Francisco, CA
July 11 - 13 2023