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ASM NEXX is a worldwide leading supplier of metallization Advanced Packaging Deposition Equipment specializing in sputtering (PVD) and plating (ECD) processes. Our highly flexible systems offering supports:

Wafer Level Sputtering Equipment
Wafer Level Plating Equipment
Panel Level Plating Equipment

Our market focus includes: WLP, 2.5D/3D IC, TSV, Fan out, Embedded Die among many others. For more information, please contact our professional team of experienced engineers worldwide here.

Apollo 300

Stratus 300

Stratus P500

Events

SEMICON EUROPA 2023
SEMICON EUROPA
November 14-17, 2023 MESSE MUNCHEN Co-located with electronica TELTEC Booth C1115
productronica 2023 Munich
Trade Fair Center Messe München
November 14 - 17 2023, BOOTH A3.480 (Hall A3)
EPTC 2023
Grand Copthorne Waterfront Hotel, Singapore
December 5 – 8 2023
SEMICON Japan 2023
Tokyo Big Sight, Japan
December 13-15 2023 BOOTH East Hall 1 - 1704 booth (join through agent)
NEPCON JAPAN 2024
Tokyo Big Sight, Japan
January 24-26 2024 Booth Number: E31-47
SMTA Pan Pacific Electronics Symposium 2024
Pan Pacific Microelectronics Symposium 2023 Kauai, Hawaii
January 29 - February 1, 2024
SPIE Photonics West 2024
The Moscone Center, San Francisco, California, USA
January 30 - February 1 2024 BOOTH 5504 (SEMI-AMICRA)
SEMICON Korea 2024
COEX Mall, Korea
January 31 - February 2 2024 BOOTH D722
IWLPC 2024
Hyatt Regency, San Francisco, California
February 13-15, 2024
IMAPS 2024
Fountain Hills, AZ
March 18-21 2024