Wafer Sputtering – Apollo 200

PVD 100-200 mm Wafer Processing

Applications
  • Configurable for up to 5 metals
  • SiC / Power Devices
  • UBM/RDL
  • RF Filters
  • EMI
Features
  • Multiple wafer size capability
  • Size Change
  • Degas/anneal
  • ICP/CCP Etch (Optimal Reactive Plasma Treatment)
Substrates
  • 100, 150, and 200 mm wafers
  • Fragile & thin wafer processing
  • Silicon, EMC, Glass, LiNbO3/LiTaO3, GaAs, Bonded

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