Wafer Plating – Stratus™ P300

ECD 300 – 200 mm Wafer Processing

Applications
  • Configurable for up to 6 metals
  • UBM/RDL
  • Fan Out
  • RF Filters
  • Power Devices
Features
  • Dual wafer size capability
  • Membrane Cells for long bath stability
  • ShearPlate™ technology for thinnest boundary layer
  • Substrate handling flexibility

Substrates

  • 300 and 200 mm wafers
  • Silicon, eWLB, Bonded, Carrier

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