Wafer Plating – Stratus™ S200
ECD 100 – 200 mm Wafer Processing
Applications
- Configurable for up to 6 metals
- UBM/RDL
- RF Filters
- Power Devices
Features
- True Bridge Tool capability
- ShearPlate™ technology for thinnest boundary layer
- Substrate handling flexibility
- Safest fragile wafer handling
- Stress control
- Substrates
- 100, 150, 200 mm wafers
- Silicon, eWlb, LiNbO3/LiTaO3, GaAs, Sapphire, Bonded