RDL Copper Plating Process for Panel Level Packaging Application

March 22, 2023

NEXX co-authored a paper (attached) that was presented (by the co-authoring chemical company, MacDermid Alpha) RDL Copper Plating Process for Panel Level Packaging Application.

Maddux Sya, Sean Fleuriel, Confesol Rodriguez, Kesheng Feng*
MacDermidAlpha Electronics Solutions, 227 Freight Street, Waterbury, CT 06702, USA
aMacDermidAlpha Electronics Solutions, No. 20, AnDong Road, Zhongli District, Taoyuan City 32063, Taiwan
Robert Moon, Dolores Cruz, Jon Hander
ASMPT NEXX, Inc. 900 Middlesex Turnpike, Building 6, Billerica, MA 01821

IMPACT 2022-US-0016-Feng-Full Paper